DISCO specializes in Thin Wafer Dicing

Aside from requiring precise control of the blade and cutting conditions, it is important to understand the material properties of a wafer before choosing a singulation method. Conducting characterization tests like X-ray diffraction and scanning electron microscopy is an excellent way to determine if the material of a wafer will pose any challenges for mechanical sawing.

Dry Wafer Dicing

Dry Wafer Dicing Services process is an important step in the manufacturing of semiconductors and integrated circuits. It is vital to achieve a high yield of functional, undamaged chips per wafer, as this will minimize production costs and increase efficiency.

Different dicing methods offer different levels of performance and quality, so it is critical to select the correct one for your specific application. The dicing method you choose will depend on factors like the material properties of the wafer, the dimensions and features of the integrated circuits, and your required precision and accuracy.

Diamond dicing blades, which are the most common type of dicing blade, have a steel core coated with diamond abrasive particles and are available in various designs. They are often hubbed or hubless and can be fabricated with different diamond grit sizes, concentrations, and bonding materials to optimize their performance for different applications. Resin-bonded dicing blades have a resin-based bonding material that holds the abrasive particles and have lower cutting forces than diamond dicing blades.

Wet Wafer Dicing

Wafer dicing is the process of separating individual integrated circuits or chips from a semiconductor wafer without damaging their delicate structures and circuits. This critical process is essential for the production of electronic devices and components used in a wide range of industries. As demand for high-performance and smaller electronic devices continues to grow, wafer dicing technology has evolved to meet these needs.

Statistical process control (SPC) is an important tool for optimizing the wafer dicing process and ensuring consistent quality results. By analyzing data on a regular basis, manufacturers can identify and address issues with a particular dicing method before they become a problem.

SPC can help manufacturers improve process consistency and achieve a higher yield of functional, undamaged die. This can reduce manufacturing costs and allow manufacturers to produce more chips at a faster rate. In addition to SPC, regular calibration and maintenance of dicing equipment is vital for maintaining accuracy and precision.

Semiconductor Dicing Services

With chip sizes continuing to shrink, the quality and precision of dicing is becoming more critical than ever. DISCO specializes in thin wafer dicing using innovative machines, blades and applications to achieve superior results.

A key part of a successful dicing process involves regular calibration and adjustments to the dicing equipment. This allows for optimal processing conditions to be maintained over time, resulting in consistent, high-quality dicing.

This includes adjusting the dressing system that exposes the diamond abrasive grit to produce an optimized surface for cutting performance. It also includes optimizing the motion control system that translates the desired cutting pattern into precise movements for the dicing machine. Performing these tasks regularly and with the proper care can significantly improve the productivity of the dicing process. This, in turn, leads to greater yields and improved product quality for the manufacturing of semiconductor devices.

Custom Dicing Services

A key step in semiconductor fabrication is substrate separation, also referred to as dicing. This involves scribing and breaking the substrate into individual pieces with well-defined edges. This is accomplished with a diamond-finished scribing wheel that generates minimal heat, reducing the chance of damaging the substrate material.

Achieving precision with a blade dicing process requires complex interactions between influencing variables such as the size and proportion of the diamond abrasive, the matrix structure and bonding strength, and the spindle power. One intervention to support blade dicing performance is trueing and dressing of the abrasive. Truing a diamond blade increases the cutting edge sharpness, mitigates chipping levels and prevents surface damage [26].

Valley can provide precise Wafer Dicing Services for bonded wafers such as SiC-on-Glass or GaAs-on-Glass. Our dicing equipment can handle materials up to 6-8 mm thick. We can cut etched patterns or circuitry on your wafers, and we can also offer high-volume contract dicing services.