California Business Blogger

Wafers are a key component for microelectronic devices. Over the past few decades, their diameter has steadily increased, allowing manufacturers to produce more chips with the same size equipment. Wafer fabs use precision dicing tools to separate the individual silicon wafers into individual die, known as "dies". Dicing can be performed on single-project wafers (MPW) or pizza wafers with reticle. High Yield Wafer Dicing Services get larger, more microchips fit on each one. But it takes a huge amount of raw material to produce those large wafers. According to Rose Associates, the actual silicon going into use in a 150mm wafer is only about 30 percent, and that percentage gets lower with each enlargement of the wafer size. KLA’s defect inspection and review systems ensure quality throughout the wafer fabrication process. Metrology and data management systems provide a comprehensive view of the entire manufacturing process, preventing production defects from impacting y